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        Silicon, GaAs wafers and other substrates become transparent at infrared (IR) wavelengths. High performance IR optics in combination with a high efficiency InGaAs camera provide images with superior resolution and contrast.


        ADVANTAGES OF MUETEC SOLUTIONS

        √  The optics are designed and optimized for the IR range from 1050 to 1550nm including IR optimized objective lenses with selectable magnifications from 2.5x, 5x, 10x, 20x, 63x, 100x.

        √  The high resolution InGaAs-camera guarantees best image resolution and highest contrast images.

        √  The IR optimized illumination path can be switched to incident and/or transmitted light.

        √  A combination of IR & visible light inspection is supported.

        √  The autofocus can be chosen between real-time laser autofocus or the highly intelligent fast image autofocus

        √  The best-in-class technology ensures worldwide leading edge performance regarding accuracy, repeatability and throughput.


        SEALING INSPECTION FOR MEMS

        With the illumination source adjusted to your application requirements (1050nm - 1550nm),  IRIS2100/IRIS2300 automatically detects smallest details such as bubbles and breaches that effect the functionality of the device. This advanced technology, in combination with our IR optimized software solution also detects delamination and eutectic bonding failures.



        DEVICE DEFECT INSPECTION

        IRIS2100/IRIS2300 enables you to detect and classify contamination and damages in the active device area. Our patented combination of visible and infrared illumination allows you to distinguish surface defects from defects deep inside the substrate.

        PRODUCTS
        • DaVinci 200IR + 300IR
          200mm MEMS inspection and metrology system (SMIF)
          DaVinci 200IR + 300IR

          Typical Applications

          Sealing Inspection after bonding (eutectic bonding or glass frit bonding)

          Device Inspection after bonding

          Overlay Metrology after bonding

          Critical Dimension Metrology after bonding


          Features

          Best inclassIR image quality with wafelengths of up to 1500nm

          Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers

          Combined reflected & transmitted light illumination modes

          SECS/GEM

        • IRIS2100
          200mm MEMS inspection and metrology system (open cassette)
          IRIS2100

          Typical Applications

          MEMS Sealing Inspection

          MEMS Device Inspection

          Overlay/CD Metrology

          Defect Review


          Features

          Best IR image quality

          Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers

          Combined reflected & transmitted light illumination modes

          SECS/GEM

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