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        HIGH THROUPUT MACRO DEFECT INSPECTION

        MueTec’s Macro Defect Inspection products are designed for customers with many different wafer types. The system is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process. Our tools can easily be setup without using much floor space. Low acquisition and operating costs guarantee a fast return on invest.


        SIGNIFICANT ADVANTAGES

        Enabling 100% wafer inspection at lithography


        √  Throughput 200 wafer per hour

        √  No recipe required for ease of use

        √  Replaces manual inspection

        √  Simulaneous wafer frontside and backside inspection

        √  Highly cost effective solution for fast return on inves




        HIGH RESOLUTION MACRO DEFECT INSPECTION

        For customers with higher resolution requirements, MueTec provides a high resolution macro defect inspection solution down to 1μm.  


        SIGNIFICANT ADVANTAGES

        √  Recipe-less algorithm: Ideal for wafer fabs with many different product types

        √  Cost effective - replaces manual inspection

        √  Two simultaneous illumination modes (bright field, dark field)

        √  Throughput of 50 wph at 2&micro;m/pixel resolution

        √  300mm FOUP or 200mm SMIF version available


        PRODUCTS
        • Rembrandt 200 / 300
          200mm MEMS inspection and metrology system (SMIF)
          Rembrandt 200 / 300

          Typical Applications

          Macro defect inspection of 200mm and 300mm wafer


          Features

          200mm SMIF or 300 mm FOUP based handling

          Data acquisition perfectly balanced to mechanical movements

          Illumination: Bright and darkfield, LED based

          Black/white and colored image of sample

          Modular system architecture results in small footprint

          Design allows addition of 3rd module and 4th FOUP

          Throughput optimized & balanced system integration avoids bottlenecks

        • MT3000
          Fully automated metrology and inspection system (open cassette)
          MT3000

          Typical Applications

          CD

          Overlay

          Film Thickness

          Defect Inspection

          Defect Review


          Features

          VIS, UV

          Simultaneous wafer handling 75 - 200mm

          SECS/GEM

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